Metastable Fine Grain Cu for Hybrid Bonding Applications

Pingping Ye; Jianwen Han; Stephan Braye; Abdelhamid ElSawy; Harshul Khanna; Veronica Hayes; Adam Letize; Kyle Whitten; Thomas Richardson; Elie Najjar

doi:10.4071/001c.129765

Ye, Pingping, Jianwen Han, Stephan Braye, Abdelhamid ElSawy, Harshul Khanna, Veronica Hayes, Adam Letize, Kyle Whitten, Thomas Richardson, and Elie Najjar. 2025. “Metastable Fine Grain Cu for Hybrid Bonding Applications.” IMAPSource Proceedings 2024 (Symposium): 108–12. https://doi.org/10.4071/001c.129765.

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Metastable Fine Grain Cu for Hybrid Bonding Applications

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