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Symposium Proceedings
Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT

Fine Gold and Coated-Ag Bonding Wire: Vertical Wire Bonding

Sarangapani Murali, Dhayalan Mariyappan, Turiano Alejandro Jr Advincula, Chong Mei Joanne Hoe, Lim Yee Evonne Weon, Kang Sungsig SS,
Vertical wire bondingstacked devicesvertical wire post heightbonding wire
https://doi.org/10.4071/001c.129760
IMAPSource Conference Papers
Murali, Sarangapani, Dhayalan Mariyappan, Turiano Alejandro Jr Advincula, Chong Mei Joanne Hoe, Lim Yee Evonne Weon, and Kang Sungsig SS. 2025. “Fine Gold and Coated-Ag Bonding Wire: Vertical Wire Bonding.” IMAPSource Proceedings 2024 (Symposium): 83–88. https:/​/​doi.org/​10.4071/​001c.129760.
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