Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-Thin Micro Dam Structures

Schirmer, Patrick, Severin Ringelstetter, Kian Chong Tai, and Muizzuddin Azfar. 2025. “Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-Thin Micro Dam Structures.” IMAPSource Proceedings 2024 (Symposium): 407–14. https:/​/​doi.org/​10.4071/​001c.129757.