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Symposium Proceedings
Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT

Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-Thin Micro Dam Structures

Patrick Schirmer, Severin Ringelstetter, Kian Chong Tai, Muizzuddin Azfar,
Heterogeneous integrationMiniaturizationSize reductionMicro dispensingUV-light curingMicro structures
https://doi.org/10.4071/001c.129757
IMAPSource Conference Papers
Schirmer, Patrick, Severin Ringelstetter, Kian Chong Tai, and Muizzuddin Azfar. 2025. “Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-Thin Micro Dam Structures.” IMAPSource Proceedings 2024 (Symposium): 407–14. https:/​/​doi.org/​10.4071/​001c.129757.
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