Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT
Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-Thin Micro Dam Structures
Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-Thin Micro Dam Structures
Schirmer, Patrick, Severin Ringelstetter, Kian Chong Tai, and Muizzuddin Azfar. 2025. “Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-Thin Micro Dam Structures.” IMAPSource Proceedings 2024 (Symposium): 407–14. https://doi.org/10.4071/001c.129757.