Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT
Characterization of Thermally-Enhanced Advanced Electronic Flip Chip CSP Packages
Characterization of Thermally-Enhanced Advanced Electronic Flip Chip CSP Packages
Nahid Aslani Amoli, Karthekeyan Sridhar, Snehamay Sinha, Jaimal Williamson, Hiep Nguyen, Arvin Verdeflor, Ayushi Pradhan, Kathleen Timbol,
Amoli, Nahid Aslani, Karthekeyan Sridhar, Snehamay Sinha, Jaimal Williamson, Hiep Nguyen, Arvin Verdeflor, Ayushi Pradhan, and Kathleen Timbol. 2025. “Characterization of Thermally-Enhanced Advanced Electronic Flip Chip CSP Packages.” IMAPSource Proceedings 2024 (Symposium): 277–84. https://doi.org/10.4071/001c.129750.