Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT
Using FEM Simulation to Predict the Mechanical and Thermal Performance of FO-EB-T Package
Using FEM Simulation to Predict the Mechanical and Thermal Performance of FO-EB-T Package
Lin, Shane Lin, Vito Lin, Teny Shih, Andrew Kang, and Y.P. Wang. 2025. “Using FEM Simulation to Predict the Mechanical and Thermal Performance of FO-EB-T Package.” IMAPSource Proceedings 2024 (Symposium): 272–76. https://doi.org/10.4071/001c.129749.