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ISSN 2380-4505
Symposium Proceedings
Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT

Materials and Process Study for Polymer Hybrid Bonding

Masaya Jukei, Kota Nomura, Yugo Tanigaki, Takenori Fujiwara, Hitoshi Araki, Tomoyuki Honda, Yu Shoji,
Chip-to-waferlow-temperature processpolyimidepolymer hybrid bonding
https://doi.org/10.4071/001c.129737
IMAPSource Conference Papers
Jukei, Masaya, Kota Nomura, Yugo Tanigaki, Takenori Fujiwara, Hitoshi Araki, Tomoyuki Honda, and Yu Shoji. 2025. “Materials and Process Study for Polymer Hybrid Bonding.” IMAPSource Proceedings 2024 (Symposium): 67–72. https:/​/​doi.org/​10.4071/​001c.129737.

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