Fan-Out Embedded Bridge with TSV (FO-EB-T) Package Solution for Enhancing HPC Application

Steven Lin; David Ho; Yu-Po Wang

doi:10.4071/001c.129736

Lin, Steven, David Ho, and Yu-Po Wang. 2025. “Fan-Out Embedded Bridge with TSV (FO-EB-T) Package Solution for Enhancing HPC Application.” IMAPSource Proceedings 2024 (Symposium): 62–66. https://doi.org/10.4071/001c.129736.

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Fan-Out Embedded Bridge with TSV (FO-EB-T) Package Solution for Enhancing HPC Application

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