Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT
An Innovative Approach for Advanced Packaging in 3D System Integration using Reconstructed Wafer-to-Wafer Bonding
An Innovative Approach for Advanced Packaging in 3D System Integration using Reconstructed Wafer-to-Wafer Bonding
Sanghoon Lee, Kyounglim Suk, Woojin Jang, Gwangjae Jeon, Jaegun Shin, Donghwi Kim, Kwangjin Moon, Jaewha Park, Seokhyun Lee, Sujin Ahn,
Lee, Sanghoon, Kyounglim Suk, Woojin Jang, Gwangjae Jeon, Jaegun Shin, Donghwi Kim, Kwangjin Moon, Jaewha Park, Seokhyun Lee, and Sujin Ahn. 2025. “An Innovative Approach for Advanced Packaging in 3D System Integration Using Reconstructed Wafer-to-Wafer Bonding.” IMAPSource Proceedings 2024 (Symposium): 56–61. https://doi.org/10.4071/001c.129733.