Laser Assisted Bonding for Flip Chip Interconnection of Very Large Chips

Cheikh Samba Sarr; David Danovitch; Malak Kanso; Pascale Gagnon; Marc-Olivier Pion

doi:10.4071/001c.129730

Sarr, Cheikh Samba, David Danovitch, Malak Kanso, Pascale Gagnon, and Marc-Olivier Pion. 2025. “Laser Assisted Bonding for Flip Chip Interconnection of Very Large Chips.” IMAPSource Proceedings 2024 (Symposium): 38–46. https://doi.org/10.4071/001c.129730.

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Laser Assisted Bonding for Flip Chip Interconnection of Very Large Chips

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