ISSN 2380-4505
Vol. 2024, Issue Symposium, 2024February 10, 2025 EDT
Difference Between 85 °C/85 %RH Accelerated Life Test and Pressure Cooker Test on Copper/Epoxy Bonding
Difference Between 85 °C/85 %RH Accelerated Life Test and Pressure Cooker Test on Copper/Epoxy Bonding
Liu, Ran, Shuaijie Zhao, Chuantong Chen, Yang Liu, Minoru Ueshima, Hirose Suzuki, Hiroto Takenaka, and Katsuaki Suganuma. 2025. “Difference Between 85 °C/85 %RH Accelerated Life Test and Pressure Cooker Test on Copper/Epoxy Bonding.” IMAPSource Proceedings 2024 (Symposium): 358–63. https://doi.org/10.4071/001c.129623.