ISSN 2380-4505
Vol. 2024, Issue Symposium, 2024February 10, 2025 EDT
Novel Approach Solder Paste Printing on 90μm Pitch Application
Novel Approach Solder Paste Printing on 90μm Pitch Application
B. Senthil Kumar, Lim Chze (Jason) Min, Yam Lip Huei, Zhang Rui Fen, Edrina Risson Olakkankal, Zhang Rui HanWen, Kang Sungsig SS,
Kumar, B. Senthil, Lim Chze (Jason) Min, Yam Lip Huei, Zhang Rui Fen, Edrina Risson Olakkankal, Zhang Rui HanWen, and Kang Sungsig SS. 2025. “Novel Approach Solder Paste Printing on 90μm Pitch Application.” IMAPSource Proceedings 2024 (Symposium): 260–65. https://doi.org/10.4071/001c.129620.