Vol. 2024, Issue Symposium, 2024February 10, 2025 EDT
Enabling High-density Heterogeneous Integration using Wafer-scale Chiplet Reconstitution Technology
Enabling High-density Heterogeneous Integration using Wafer-scale Chiplet Reconstitution Technology
Victor, Ashita, and Muhannad S. Bakir. 2025. “Enabling High-Density Heterogeneous Integration Using Wafer-Scale Chiplet Reconstitution Technology.” IMAPSource Proceedings 2024 (Symposium): 243–48. https://doi.org/10.4071/001c.129616.