Low Warpage Liquid Compression Molded Underfill for Wafer Level Packaging

Yijia Ma; Jimmy Nguyen; Rose Ha; Mark Hoshiyama; Tim Champagne; Kail Shim; Raj Peddi

doi:10.4071/001c.129614

Ma, Yijia, Jimmy Nguyen, Rose Ha, Mark Hoshiyama, Tim Champagne, Kail Shim, and Raj Peddi. 2025. “Low Warpage Liquid Compression Molded Underfill for Wafer Level Packaging.” IMAPSource Proceedings 2024 (Symposium): 155–60. https://doi.org/10.4071/001c.129614.

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