Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration

C. Lin; J. H. Lau; C. Chen; H. Yang; T. Xia; C. Ko; B. Lin; M. Ma; T. Tseng

doi:10.4071/001c.129610

Lin, C., J. H. Lau, C. Chen, H. Yang, T. Xia, C. Ko, B. Lin, M. Ma, and T. Tseng. 2025. “Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration.” IMAPSource Proceedings 2024 (Symposium): 342–47. https://doi.org/10.4071/001c.129610.

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Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration

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