ISSN 2380-4505
Vol. 2024, Issue Symposium, 2024February 10, 2025 EDT
High Performance and Cost-Effective Wafer Bumping Approach with Solder Paste Printing for Small LED Die
High Performance and Cost-Effective Wafer Bumping Approach with Solder Paste Printing for Small LED Die
Zhang, HanWen, Guo An “Andy” Li, Kung Chuan “Kenny” Chiong, Hui Kai “Vito” Hsu, B. Senthil Kumar, Chze Min “Jason” Lim, and Thiam Chye Lim. 2025. “High Performance and Cost-Effective Wafer Bumping Approach with Solder Paste Printing for Small LED Die.” IMAPSource Proceedings 2024 (Symposium): 335–41. https://doi.org/10.4071/001c.129609.