ISSN 2380-4505
Vol. 2024, Issue Symposium, 2024February 07, 2025 EDT
Thermal Expansion Control of Printed Circuit Boards Using Copper-Molybdenum Composite Materials
Thermal Expansion Control of Printed Circuit Boards Using Copper-Molybdenum Composite Materials
Ito, Yohei, Kenjiro Takanishi, Tatsuya Sakamoto, Keisuke Fujiwara, and Hitoshi Arai. 2025. “Thermal Expansion Control of Printed Circuit Boards Using Copper-Molybdenum Composite Materials.” IMAPSource Proceedings 2024 (Symposium): 234–38. https://doi.org/10.4071/001c.129523.