Solder Joint Reliability of Glass Core Substrate Assembly

John H Lau; Ning Liu; Mike Ma; Tzyy-Jang Tseng

doi:10.4071/001c.129522

Lau, John H, Ning Liu, Mike Ma, and Tzyy-Jang Tseng. 2025. “Solder Joint Reliability of Glass Core Substrate Assembly.” IMAPSource Proceedings 2024 (Symposium): 228–33. https://doi.org/10.4071/001c.129522.

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