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Symposium Proceedings
Vol. 2024, Issue Symposium, 2024February 07, 2025 EDT

Evaluation and Process Optimization of Heat-Curable Thermal Interface Materials for Advanced Packages

Kevin Cox, Joanna Painter, Ghassan Abu-hamdeh, Steven Tonthat, Matt Borden, Jason Krantz,
Thermal interface materialvoidingflip-chiplaser flash analysis
https://doi.org/10.4071/001c.129521
IMAPSource Conference Papers
Cox, Kevin, Joanna Painter, Ghassan Abu-hamdeh, Steven Tonthat, Matt Borden, and Jason Krantz. 2025. “Evaluation and Process Optimization of Heat-Curable Thermal Interface Materials for Advanced Packages.” IMAPSource Proceedings 2024 (Symposium): 222–27. https:/​/​doi.org/​10.4071/​001c.129521.
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