Effects of Constraints on Solder Joint Reliability of Electronic Packages

Arvind Purushotaman; Natalie Raines; Masoud Angas; Robert Manzanares; Nathan Blattau

doi:10.4071/001c.129520

Purushotaman, Arvind, Natalie Raines, Masoud Angas, Robert Manzanares, and Nathan Blattau. 2025. “Effects of Constraints on Solder Joint Reliability of Electronic Packages.” IMAPSource Proceedings 2024 (Symposium): 141–48. https://doi.org/10.4071/001c.129520.

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