Multiphysics Reliability Simulation and Validation of a Flip-Chip Build-Up Film Crack via Piezoresistive Stress Sensor

Yutaka Suzuki; Jaimal Williamson; Blake Travis; Tobias Fritz; Cynthia Chapa; Rajen Murugan

doi:10.4071/001c.129518

Suzuki, Yutaka, Jaimal Williamson, Blake Travis, Tobias Fritz, Cynthia Chapa, and Rajen Murugan. 2025. “Multiphysics Reliability Simulation and Validation of a Flip-Chip Build-Up Film Crack via Piezoresistive Stress Sensor.” IMAPSource Proceedings 2024 (Symposium): 125–33. https://doi.org/10.4071/001c.129518.

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