This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:29579/feed
ISSN 2380-4505
Symposium Proceedings
Vol. 2024, Issue Symposium, 2024February 07, 2025 EDT

The Quarter Factor Prediction of Mold Void Mechanism between Structure Ratio and Molding Gate

Tzu Chieh Chien, Shih Kun Lo, Zong Yuan Li, Min Yen Hsu, Yen Hua Kuo, Hui Chung Liu, Lu Ming Lai, Kuang Hsiung Chen,
Mold voidincomplete fillingMolding resistanceMolding gateMold void prediction
https://doi.org/10.4071/001c.129514
IMAPSource Conference Papers
Chien, Tzu Chieh, Shih Kun Lo, Zong Yuan Li, Min Yen Hsu, Yen Hua Kuo, Hui Chung Liu, Lu Ming Lai, and Kuang Hsiung Chen. 2025. “The Quarter Factor Prediction of Mold Void Mechanism between Structure Ratio and Molding Gate.” IMAPSource Proceedings 2024 (Symposium): 24–29. https:/​/​doi.org/​10.4071/​001c.129514.

View more stats

Powered by Scholastica, the modern academic journal management system