ISSN 2380-4505
Vol. 2024, Issue Symposium, 2024February 07, 2025 EDT
HPC Packaging Platform Including Compression Molding
HPC Packaging Platform Including Compression Molding
Marius Adler, Karl-Friedrich Becker, Tanja Braun, Marc Dreissigacker, Ole Hoelck, A. Gaebler, Uwe Maass, Ivan Ndip, K. Zoschke, Michael Schiffer, Martin Schneider-Ramelow,
Adler, Marius, Karl-Friedrich Becker, Tanja Braun, Marc Dreissigacker, Ole Hoelck, A. Gaebler, Uwe Maass, et al. 2025. “HPC Packaging Platform Including Compression Molding.” IMAPSource Proceedings 2024 (Symposium): 17–23. https://doi.org/10.4071/001c.129513.