Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:58488/feed
Symposium Proceedings
Vol. 2024, Issue Symposium, 2024February 07, 2025 EDT

Optimizing Chiplet Disaggregation with Package Technology

Trent Uehling, Julian Pontes, Carl Culshaw, Karl Leiss,
ArchitectureChipletDisaggregationMicrocontrollerMicroprocessorPackaging
https://doi.org/10.4071/001c.129511
IMAPSource Conference Papers
Uehling, Trent, Julian Pontes, Carl Culshaw, and Karl Leiss. 2025. “Optimizing Chiplet Disaggregation with Package Technology.” IMAPSource Proceedings 2024 (Symposium): 5–10. https:/​/​doi.org/​10.4071/​001c.129511.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system