Custom, High Density Power Modules Enabled by Thermal Integration Technologies

Errol Porter

doi:10.4071/001c.129114

Porter, Errol. 2025. “Custom, High Density Power Modules Enabled by Thermal Integration Technologies.” IMAPSource Proceedings 2024 (DPC): 1133–64. https://doi.org/10.4071/001c.129114.

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Custom, High Density Power Modules Enabled by Thermal Integration Technologies

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