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Device Packaging Conference Presentations
Vol. 2024, Issue DPC, 2024January 27, 2025 EDT

Soldering Defects on Immersion Tin and the Impact of the Tin-Oxide Layer

Britta Schafsteller, Bernhard Schachtner, Kenneth Lee, Hubertus Mertens, Gustavo Ramos,
immersion tintin-oxide layersoldering
https://doi.org/10.4071/001c.129079
IMAPSource Conference Papers
Schafsteller, Britta, Bernhard Schachtner, Kenneth Lee, Hubertus Mertens, and Gustavo Ramos. 2025. “Soldering Defects on Immersion Tin and the Impact of the Tin-Oxide Layer.” IMAPSource Proceedings 2024 (DPC): 1097–1118. https:/​/​doi.org/​10.4071/​001c.129079.
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