Heterogeneous Packaging Technologies for Chiplet and Memory Integration

Yan Li; WooPoung Kim

doi:10.4071/001c.129076

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Li, Yan, and WooPoung Kim. 2025. “Heterogeneous Packaging Technologies for Chiplet and Memory Integration.” IMAPSource Proceedings 2024 (DPC): 1033–50. https://doi.org/10.4071/001c.129076.

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Heterogeneous Packaging Technologies for Chiplet and Memory Integration

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