Vol. 2024, Issue DPC, 2024January 27, 2025 EDT
Heterogeneous Packaging Technologies for Chiplet and Memory Integration
Heterogeneous Packaging Technologies for Chiplet and Memory Integration
Li, Yan, and WooPoung Kim. 2025. “Heterogeneous Packaging Technologies for Chiplet and Memory Integration.” IMAPSource Proceedings 2024 (DPC): 1033–50. https://doi.org/10.4071/001c.129076.