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Device Packaging Conference Presentations
Vol. 2024, Issue DPC, 2024January 27, 2025 EDT

2nd Generation 3D V-Cache TM Enablement

Arsalan Alam, Chandrasekhar Mandalapu, Patrick Cheng, ChihHsiang Tseng, Sean Liu, Liwei Wang, Mihaela Tanasescu, Mahmudur Chowdhury, Aly Garcia, Anadi Srivastava, Sai Vadlamani, Sireesha Gogineni, Tanmay Mudholkar, Jiali ORiain, Yash Kothari, Yong fui Lee, Litao Yang, Anna Yang, Pawan Kulkarni, Aaron Blanchet, Rita Pillman, Bryan Weatherford, Tao Chen, Yolanda Liu, Raja Swaminathan,
3D stackinghybrid bonding2ndGeneration 3D V-CacheTMEnablement
https://doi.org/10.4071/001c.129075
IMAPSource Conference Papers
Alam, Arsalan, Chandrasekhar Mandalapu, Patrick Cheng, ChihHsiang Tseng, Sean Liu, Liwei Wang, Mihaela Tanasescu, et al. 2025. “2nd Generation 3D V-Cache TM Enablement.” IMAPSource Proceedings 2024 (DPC): 1015–32. https:/​/​doi.org/​10.4071/​001c.129075.
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