Chiplets and Heterogeneous IC Packaging: Building Blocks and Tradeoffs

Mike Kelly; Dave Hiner; Suresh Jayaraman

doi:10.4071/001c.129072

Kelly, Mike, Dave Hiner, and Suresh Jayaraman. 2025. “Chiplets and Heterogeneous IC Packaging: Building Blocks and Tradeoffs.” IMAPSource Proceedings 2024 (DPC): 980–1014. https://doi.org/10.4071/001c.129072.

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Chiplets and Heterogeneous IC Packaging: Building Blocks and Tradeoffs

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