Vol. 2024, Issue DPC, 2024January 23, 2025 EDT
Advances in Vertical Wire Bonding Enable Low-Cost Shielding and Wafer Level Interconnect Solutions
Advances in Vertical Wire Bonding Enable Low-Cost Shielding and Wafer Level Interconnect Solutions
Foley, John. 2025. “Advances in Vertical Wire Bonding Enable Low-Cost Shielding and Wafer Level Interconnect Solutions.” IMAPSource Proceedings 2024 (DPC): 775–86. https://doi.org/10.4071/001c.129015.