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Device Packaging Conference Presentations
Vol. 2024, Issue DPC, 2024January 23, 2025 EDT

Liquid Metal Embedded Elastomers (LMEE) as Low-BLT Thermal Interface Materials

Dylan Shah,
liquid metal embedded elastomers (LMEE)low BLTTIMsthermal performance
https://doi.org/10.4071/001c.129014
IMAPSource Conference Papers
Shah, Dylan. 2025. “Liquid Metal Embedded Elastomers (LMEE) as Low-BLT Thermal Interface Materials.” IMAPSource Proceedings 2024 (DPC): 757–74. https:/​/​doi.org/​10.4071/​001c.129014.
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