Annealing Behavior of Electroplated Nano-grained Copper

Tsvetina Dobrovolska; Martin Mack; Klaus Leyendecker; Yun Zhang; Peipei Dong; Kevin Martin

doi:10.4071/001c.129012

Dobrovolska, Tsvetina, Martin Mack, Klaus Leyendecker, Yun Zhang, Peipei Dong, and Kevin Martin. 2025. “Annealing Behavior of Electroplated Nano-Grained Copper.” IMAPSource Proceedings 2024 (DPC): 718–36. https://doi.org/10.4071/001c.129012.

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Annealing Behavior of Electroplated Nano-grained Copper

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