Vol. 2024, Issue DPC, 2024January 23, 2025 EDT
Achieving Large-Scale HBM Integration with Adaptive Pad Stacks on Molded Embedded Bridge Die Interposers
Achieving Large-Scale HBM Integration with Adaptive Pad Stacks on Molded Embedded Bridge Die Interposers
San Jose, Benedict, Cliff Sandstrom, Craig Bishop, and Tim Olson. 2025. “Achieving Large-Scale HBM Integration with Adaptive Pad Stacks on Molded Embedded Bridge Die Interposers.” IMAPSource Proceedings 2024 (DPC): 581–608. https://doi.org/10.4071/001c.129005.