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Device Packaging Conference Presentations
Vol. 2024, Issue DPC, 2024January 23, 2025 EDT

Achieving Large-Scale HBM Integration with Adaptive Pad Stacks on Molded Embedded Bridge Die Interposers

Benedict San Jose, Cliff Sandstrom, Craig Bishop, Tim Olson,
chipletsincrease package sizesfan-out technologylarge paneladaptive patterning
https://doi.org/10.4071/001c.129005
IMAPSource Conference Papers
San Jose, Benedict, Cliff Sandstrom, Craig Bishop, and Tim Olson. 2025. “Achieving Large-Scale HBM Integration with Adaptive Pad Stacks on Molded Embedded Bridge Die Interposers.” IMAPSource Proceedings 2024 (DPC): 581–608. https:/​/​doi.org/​10.4071/​001c.129005.
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