This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:39619/feed
ISSN 2380-4505
EMPC Conference Proceedings (IMAPS Europe)
Vol. 2024, Issue DPC, 2024January 14, 2025 EDT

Multi-axis Process integration for Wafer Scale and Substrate-Like Printed Electronics

C. Mike Newton, Rudy Ghosh, Grant Wachtel, Connor Whitley,
wafer level chip scale packagingprecision patterningprocess integration
https://doi.org/10.4071/001c.128408
IMAPSource Conference Papers
Newton, C. Mike, Rudy Ghosh, Grant Wachtel, and Connor Whitley. 2025. “Multi-Axis Process Integration for Wafer Scale and Substrate-Like Printed Electronics.” IMAPSource Proceedings 2024 (DPC): 445–81. https:/​/​doi.org/​10.4071/​001c.128408.

View more stats

Powered by Scholastica, the modern academic journal management system