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Device Packaging Conference Presentations
Vol. 2024, Issue DPC, 2024January 14, 2025 EDT

Aerosol Jet Printing for Three Dimensional Interconnects

Michael Renn,
aerosol jet printinggold inksprinted interconnects
https://doi.org/10.4071/001c.128404
IMAPSource Conference Papers
Renn, Michael. 2025. “Aerosol Jet Printing for Three Dimensional Interconnects.” IMAPSource Proceedings 2024 (DPC): 393–414. https:/​/​doi.org/​10.4071/​001c.128404.
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