Vol. 2024, Issue DPC, 2024January 14, 2025 EDT
Scalable Core Package for Power Module with Double-Sided Cooling Capability Applying Fan-out Panel-Level Process Suitable for SiC and GaN
Scalable Core Package for Power Module with Double-Sided Cooling Capability Applying Fan-out Panel-Level Process Suitable for SiC and GaN
Takao, Katsuhiro, Atsushi Kuroha, Michihito Kawada, Ichiro Kono, Takashi Suzuki, and Yoshiaki Aizawa. 2025. “Scalable Core Package for Power Module with Double-Sided Cooling Capability Applying Fan-out Panel-Level Process Suitable for SiC and GaN.” IMAPSource Proceedings 2024 (DPC): 351–78. https://doi.org/10.4071/001c.128399.