Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:26648/feed
Device Packaging Conference Presentations
Vol. 2024, Issue DPC, 2024January 14, 2025 EDT

Patterning Fine Pitch L/S on Photosensitive PBO Using Laser Direct Imaging for High-Density Interconnect Applications

Siyang Liu, Mayukh Nandy, Yanze Wu, Hongbin Yu,
photosensitive pbolaser direct imagingfine pitch pattern
https://doi.org/10.4071/001c.128396
IMAPSource Conference Papers
Liu, Siyang, Mayukh Nandy, Yanze Wu, and Hongbin Yu. 2025. “Patterning Fine Pitch L/S on Photosensitive PBO Using Laser Direct Imaging for High-Density Interconnect Applications.” IMAPSource Proceedings 2024 (DPC): 322–50. https:/​/​doi.org/​10.4071/​001c.128396.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system