ISSN 2380-4505
Vol. 2024, Issue DPC, 2024January 14, 2025 EDT
Patterning Fine Pitch L/S on Photosensitive PBO Using Laser Direct Imaging for High-Density Interconnect Applications
Patterning Fine Pitch L/S on Photosensitive PBO Using Laser Direct Imaging for High-Density Interconnect Applications
Liu, Siyang, Mayukh Nandy, Yanze Wu, and Hongbin Yu. 2025. “Patterning Fine Pitch L/S on Photosensitive PBO Using Laser Direct Imaging for High-Density Interconnect Applications.” IMAPSource Proceedings 2024 (DPC): 322–50. https://doi.org/10.4071/001c.128396.