Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages

Wenhao (Eric) Li; Feras Eid; Yoshihiro Tomita; Johanna Swan

doi:10.4071/001c.128390

Li, Wenhao (Eric), Feras Eid, Yoshihiro Tomita, and Johanna Swan. 2025. “Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages.” IMAPSource Proceedings 2024 (DPC): 243–60. https://doi.org/10.4071/001c.128390.

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Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages

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