Vol. 2024, Issue DPC, 2024January 14, 2025 EDT
Exploring the Engineering of Copper Grains to Electroplate Bamboo-Like Structures and Foster Cu (111) Oriented Films in Pursuit of Enhanced Device Reliability
Exploring the Engineering of Copper Grains to Electroplate Bamboo-Like Structures and Foster Cu (111) Oriented Films in Pursuit of Enhanced Device Reliability
El-Sawy, Abdelhamid. 2025. “Exploring the Engineering of Copper Grains to Electroplate Bamboo-Like Structures and Foster Cu (111) Oriented Films in Pursuit of Enhanced Device Reliability.” IMAPSource Proceedings 2024 (DPC): 191–220. https://doi.org/10.4071/001c.128387.