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Device Packaging Conference Presentations
Vol. 2024, Issue DPC, 2024January 14, 2025 EDT

Exploring the Engineering of Copper Grains to Electroplate Bamboo-Like Structures and Foster Cu (111) Oriented Films in Pursuit of Enhanced Device Reliability

Abdelhamid El-Sawy,
grain engineeringbamboo-cu filmcu(111)
https://doi.org/10.4071/001c.128387
IMAPSource Conference Papers
El-Sawy, Abdelhamid. 2025. “Exploring the Engineering of Copper Grains to Electroplate Bamboo-Like Structures and Foster Cu (111) Oriented Films in Pursuit of Enhanced Device Reliability.” IMAPSource Proceedings 2024 (DPC): 191–220. https:/​/​doi.org/​10.4071/​001c.128387.
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