Vol. 2024, Issue DPC, 2024January 14, 2025 EDT
High-end Smartphone SoC Packaging Comparison - Advanced PoP Technology from Standard, Fan-Out to Flip-Chip Assembly
High-end Smartphone SoC Packaging Comparison - Advanced PoP Technology from Standard, Fan-Out to Flip-Chip Assembly
Mazari, Rayane, and Gabriela Pereira. 2025. “High-End Smartphone SoC Packaging Comparison - Advanced PoP Technology from Standard, Fan-Out to Flip-Chip Assembly.” IMAPSource Proceedings 2024 (DPC): 118–39. https://doi.org/10.4071/001c.128334.