Vol. 2024, Issue DPC, 2024January 14, 2025 EDT
Materials-Technology Co-Optimization (MTCO) for Inter-Die-Gap-Fill (IDGF) in Heterogeneous Integration of Chiplets
Materials-Technology Co-Optimization (MTCO) for Inter-Die-Gap-Fill (IDGF) in Heterogeneous Integration of Chiplets
Seutter, Sean, Zongbin Wang, Lulu Xiong, Peng Luo, Zijie Hong, Doug Lee, Balamurugan Ramasamy, Peng Suo, Prayudi Lianto, and Guan Huei See. 2025. “Materials-Technology Co-Optimization (MTCO) for Inter-Die-Gap-Fill (IDGF) in Heterogeneous Integration of Chiplets.” IMAPSource Proceedings 2024 (DPC): 100–117. https://doi.org/10.4071/001c.128333.