Vol. 2024, Issue DPC, 2024January 14, 2025 EDT
High Density Organic Substrates for Chiplet Technologies
High Density Organic Substrates for Chiplet Technologies
Böttcher, Lars. 2025. “High Density Organic Substrates for Chiplet Technologies.” IMAPSource Proceedings 2024 (DPC): 67–99. https://doi.org/10.4071/001c.128332.