Application of Picosecond Acoustic Metrology for monitoring Metal Films in Advanced Packaging

M. Mehendale; K. Park; Y. T. Han; J. Dai; C. Kim; G. A. Antonelli; P. Mukundhan

doi:10.4071/001c.128331

Mehendale, M., K. Park, Y. T. Han, J. Dai, C. Kim, G. A. Antonelli, and P. Mukundhan. 2025. “Application of Picosecond Acoustic Metrology for Monitoring Metal Films in Advanced Packaging.” IMAPSource Proceedings 2024 (DPC): 47–66. https://doi.org/10.4071/001c.128331.

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Application of Picosecond Acoustic Metrology for monitoring Metal Films in Advanced Packaging

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