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Device Packaging Conference Presentations
Vol. 2024, Issue DPC, 2024January 14, 2025 EDT

Reliable Direct Bonded Heterogeneous Integration (DBHi) for AI Hardware

Divya Taneja, Katherine Pilger, Alexis Jacques-Fortin, Maxime Godard, Isabel de Sousa, Sayuri Kohara, Chinami Marushima, Takahito Watanabe, Akihiro Horibe, Joseph Ross, Thomas Wassick,
heterogenous integrationDBHI architecturebridge region
https://doi.org/10.4071/001c.128330
IMAPSource Conference Papers
Taneja, Divya, Katherine Pilger, Alexis Jacques-Fortin, Maxime Godard, Isabel de Sousa, Sayuri Kohara, Chinami Marushima, et al. 2025. “Reliable Direct Bonded Heterogeneous Integration (DBHi) for AI Hardware.” IMAPSource Proceedings 2024 (DPC): 28–46. https:/​/​doi.org/​10.4071/​001c.128330.
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