Vol. 2020, Issue DPC, 2020April 24, 2024 EDT
Memory Chip-to-Chip Integration for High Bandwidth Memory Processor Interface
Memory Chip-to-Chip Integration for High Bandwidth Memory Processor Interface
Heinig, Andy, and Fabian Hopsch. 2024. “Memory Chip-to-Chip Integration for High Bandwidth Memory Processor Interface.” IMAPSource Proceedings 2020 (DPC): 906–35. https://doi.org/10.4071/001c.117018.