ISSN 2380-4505
Vol. 2020, Issue DPC, 2020April 24, 2024 EDT
Die Backside Metallization for Low Cost High Thermal Package
Die Backside Metallization for Low Cost High Thermal Package
Islam, Nokibul. 2024. “Die Backside Metallization for Low Cost High Thermal Package.” IMAPSource Proceedings 2020 (DPC): 885–905. https://doi.org/10.4071/001c.117008.