Vol. 2020, Issue DPC, 2020April 24, 2024 EDT
10 micron Pitch Wiring and Bump on Substrate Formed by Imprinting Technology to Apply Low Temperature Flip Chip Bonding
10 micron Pitch Wiring and Bump on Substrate Formed by Imprinting Technology to Apply Low Temperature Flip Chip Bonding
Komatsu, Hiroshi, Nozomi Shimoishizaka, and Toshihiro Yamada. 2024. “10 Micron Pitch Wiring and Bump on Substrate Formed by Imprinting Technology to Apply Low Temperature Flip Chip Bonding.” IMAPSource Proceedings 2020 (DPC): 766–810. https://doi.org/10.4071/001c.117002.