Vol. 2020, Issue DPC, 2020April 24, 2024 EDT
Advanced Double Side SiPwith Thermal Enhance Solutions for 5G Mobile Application
Advanced Double Side SiPwith Thermal Enhance Solutions for 5G Mobile Application
Tsai, Wen-Jung (Mike). 2024. “Advanced Double Side SiPwith Thermal Enhance Solutions for 5G Mobile Application.” IMAPSource Proceedings 2020 (DPC): 496–527. https://doi.org/10.4071/001c.116985.