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Device Packaging Conference Presentations
Vol. 2020, Issue DPC, 2020April 24, 2024 EDT

Enabling Fine Line RDL and High Aspect Ratios for CU Pillars for Heterogeneous Integration

Fabian Benthaus, Habib Hichri, Markus Arendt, Matthew Gingerella,
Heterogeneous Integration3D IntegrationFOWLP
https://doi.org/10.4071/001c.116981
IMAPSource Conference Papers
Benthaus, Fabian, Habib Hichri, Markus Arendt, and Matthew Gingerella. 2024. “Enabling Fine Line RDL and High Aspect Ratios for CU Pillars for Heterogeneous Integration.” IMAPSource Proceedings 2020 (DPC): 306–40. https:/​/​doi.org/​10.4071/​001c.116981.
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