Vol. 2020, Issue DPC, 2020April 18, 2024 EDT
Embedded Trace and RDL Copper Plating Process for Panel Level Packaging Applications
Embedded Trace and RDL Copper Plating Process for Panel Level Packaging Applications
Feng, Kesheng, Leslie Kim, Johnny Lee, Saminda Dharmarathna, William Bowerman, and Jim Watkowski. 2024. “Embedded Trace and RDL Copper Plating Process for Panel Level Packaging Applications.” IMAPSource Proceedings 2020 (DPC): 359–86. https://doi.org/10.4071/001c.116712.