Vol. 2020, Issue DPC, 2020April 18, 2024 EDT
Multipurpose Use of Laser-Sensitive Materials for Temporary Bonding and Debonding Applications in Wafer-Level Packaging
Multipurpose Use of Laser-Sensitive Materials for Temporary Bonding and Debonding Applications in Wafer-Level Packaging
Prenger, Luke. 2024. “Multipurpose Use of Laser-Sensitive Materials for Temporary Bonding and Debonding Applications in Wafer-Level Packaging.” IMAPSource Proceedings 2020 (DPC): 387–420. https://doi.org/10.4071/001c.116711.